3C electronics industry, wearable devices manufacturing, assembly process there are many need to use optical methods for quality control or defect detection. Common inspection content includes consumer electronics shell and structural components of the appearance of defects in the monitoring, dimensional measurement, shipment sampling, component failure analysis, PCB board drilling depth measurement, diameter measurement, sidewall impurity residue, copper plating quality inspection.
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From low to high magnification
Covering a magnification range of 20-7500x, it simultaneously meets the needs of users to analyze samples from macroscopic observation to microscopic detection.
Omni-directional observation system
When using the carrier stage with angular rotation, simply rotate the carrier stage for fast observation of samples without touching the moving sample and higher sample compatibility.
Multi Lighting Mode Integration
The combination of multiple lighting methods makes defects invisible, and the best image function allows even novices to find defects quickly.
Sample Measurement and Analysis
Self-developed 3D reconstruction algorithm can meet the customer's needs for efficiency, but also to achieve a high degree of reproduction of the sample morphology. A variety of measurement and analysis functions to meet customer applications in different fields.
