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Providing users with efficient industrial inspection solutions

Real-time imaging and observation of the inside of packaged chips and wafers

Wide spectral range in the infrared band (900-1700nm), low scattering and strong penetration

Wide spectral range in the infrared band (900-1700nm), low scattering and strong penetration

Large numerical aperture objective eliminates aberrations for accurate infrared detection

Dedicated infrared objective lens with ultra-wide spectrum for clearer imaging

□ Equipped with 5X-50X professional infrared objective lenses, providing aberration correction from visible to near infrared wavelengths, suitable for conventional bright field and specialized infrared observation.
□ For high magnification numerical objective lenses with larger aperture, a correction ring is added, which can correct the aberration caused by the difference in thickness of the cover sheet, realizing high-definition and accurate detection in the near infrared wavelength band.

Comparison of imaging images from 1.3 and 3.2 megapixel cameras

Wide-spectrum specialized infrared cameras

Adopting wide-spectrum specialized infrared camera, covering bright field and infrared observation, the whole machine has wide field illumination, wide imaging field and high resolution. With band-pass filter for face detection, it can realize the response to different parts of the chip inside the silicon wafer to meet the needs of different customers.

Before Image Enhancement vs After Image Enhancement

Self-developed software, powerful operation

Adopting Mvimage special image software, it adds infrared-specific image enhancement functions to the conventional image management, measurement, image acquisition, layer management and other functional modules, and can also customize and develop automatic detection functions according to customer needs.