Wafer Surface Defect Detection

Wafer fabrication is a complex process with hundreds of steps involving multiple processes such as oxide annealing, deposition, lithography, etching, ion implantation and CMP polishing. These processes often need to be repeated, and the wafers must be inspected for defects after each process to ensure quality control at each step.

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The Importance of Wafer Surface Defect Detection in Semiconductor Manufacturing Processes

What stage of the semiconductor manufacturing process is it primarily used in?

After each critical stage of semiconductor production, such as lithography, etching or cmp polishing, wafer defect inspection equipment is used to check the wafer surface for scratches, particulate foreign matter and other types of defects.

What defects can be identified?

Capable of accurate detection of 2D and 3D graphic defects, these devices are suitable for a wide range of critical semiconductor manufacturing processes, including adi (Application Driver Integration), AEI (Application Equipment Integration), CMP (Chemical Mechanical Polishing), and OOA (Out-Of-Air Quality Assurance). By detecting a wide range of defects such as particles, scratches, graphic defects, adhesive residue and cracks, these devices can significantly improve line yields and product quality.

What are the implications for production management?

Semiconductor wafer defect inspection equipment plays a vital role in ensuring the production of high-quality, high-reliability semiconductor products. Through continuous monitoring and defect detection of wafers after each process, it helps semiconductor manufacturers improve yields, reduce scrap, lower costs and ultimately optimize products and services.

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Highly flexible and adaptable

The equipment supports the inspection of 4 to 12-inch wafers, covering a wide range of semiconductor manufacturing needs, and is capable of adapting to wafers of different sizes and technical requirements.

Full range of defect detection

The equipment utilizes advanced image processing technology to enable detailed detection of 2D and 3D graphic defects, ensuring comprehensive quality control from micro to macro.

Targeted process applications

Suitable for multiple key production stages such as ADI, AE1, Cmp and oqa, it enables effective monitoring and control at every critical point in the production process.

Improve productivity and reduce costs

Timely detection and rejection of defective wafers to prevent unqualified products from flowing into the next process, thus reducing scrap rate and production costs.

Ergonomic design

The equipment is designed for stability and safety to ensure efficient and reliable operation in a continuous production environment. Easy and comfortable to operate, in line with ergonomic principles, reduce the labor intensity of the operator, improve operational efficiency and accuracy.