Utilizing a high-precision optical detection system, the equipment scans wafer boxes layer by layer, recording wafer position information. It quickly and accurately identifies issues such as wafer misalignment and provides alerts for abnormal conditions, achieving 100% accuracy.

Utilizing Non-Contact Optical Methods To Locate The Wafer's Center And Notch/Flat.

The Fully Automated Pre-Alignment Mechanism Enables Fast And Accurate Target Positioning.

Applicable To Various Wafer Materials, Including Si, SiC, EMC, And Glass.

The AWL Series Features A Macro Inspection Arm For 360° Rotation, Enabling Surface And Back Inspection Of The Wafer. It Helps Identify Defects And Particles On Both Sides And Edges. The Wafer Can Be Freely Tilted For Observation, Allowing Comprehensive Visual Inspection At Various Angles.

Utilizing A Wide Beam Imaging System, It Supports 25mm Ultra-Wide Field Observation. The Optical System Features A Polarization System And A High-Contrast Differential Interference Contrast Imaging System, Providing High-Resolution Microscopic Imaging.

Mvlmage 3.0 Software Features An Electric Platform, Z-Axis, Converter, And Light Control. It Supports Automatic Stitching, Depth Fusion, Autofocus, And 3D Measurement. Compatible With 64-Bit Windows And MX Series Microscopes.